Sign in to ask questions about the Renesas 89H32NT24AG2ZBHLI8 datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
Renesas 89H32NT24AG2ZBHLI8 technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Package Description | Flip Chip Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 484 |
| PCB | 484 |
| Package Length (mm) | 23 |
| Package Width (mm) | 23 |
| Package Height (mm) | 2.32(Max) |
| Seated Plane Height (mm) | 2.92(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| PCIe Generation | Gen2 |
| Type | System Interconnect Switch |
| PCIe Revision | 2.1 |
| Number of Lanes | 32 |
| Number of Ports | 24 |
| Typical Single Supply Voltage | 1|2.5|3.3V |
| Maximum Power Dissipation | 7.25W |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | SAN34 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Renesas 89H32NT24AG2ZBHLI8 to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
