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Technical Specifications
Renesas 89H32NT24AG2ZBHLI8 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Package Description | Flip Chip Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 484 |
| PCB | 484 |
| Package Length (mm) | 23 |
| Package Width (mm) | 23 |
| Package Height (mm) | 2.32(Max) |
| Seated Plane Height (mm) | 2.92(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| PCIe Generation | Gen2 |
| Type | System Interconnect Switch |
| PCIe Revision | 2.1 |
| Number of Lanes | 32 |
| Number of Ports | 24 |
| Typical Single Supply Voltage | 1|2.5|3.3V |
| Maximum Power Dissipation | 7.25W |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | SAN34 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Renesas 89H32NT24AG2ZBHLI8 Datasheet
Download the complete datasheet for Renesas 89H32NT24AG2ZBHLI8 to view detailed technical specifications.
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