The 89H32NT8AG2ZBHL is a system interconnect switch with 32 lanes, 8 ports, and 1 channel. It is a Gen2 PCIe device with a Ball Grid Array package type. The package is a Flip Chip Ball Grid Array with 484 pins, measuring 23mm in length and 23mm in width, with a maximum height of 2.32mm and seated plane height of 2.92mm. The package material is plastic and it is designed for surface mount. The switch operates within a temperature range of 0°C to 70°C.
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Renesas 89H32NT8AG2ZBHL technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Package Description | Flip Chip Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 484 |
| PCB | 484 |
| Package Length (mm) | 23 |
| Package Width (mm) | 23 |
| Package Height (mm) | 2.32(Max) |
| Seated Plane Height (mm) | 2.92(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| PCIe Generation | Gen2 |
| Type | System Interconnect Switch |
| Number of Lanes | 32 |
| Number of Ports | 8 |
| Number of Channels | 1 |
| Traffic Class | 8 |
| Typical Single Supply Voltage | 1|2.5|3.3V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Cage Code | SAN34 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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