32-lane, 8-port PCI Express Gen2 I/O expansion switch. Features a 484-pin Flip Chip Ball Grid Array (FCBGA) package with a 23mm x 23mm footprint and 1mm pin pitch, designed for surface mounting. Operates with a typical single supply voltage of 1V and offers a maximum power dissipation of 9.71W. Suitable for applications within a 0°C to 70°C operating temperature range.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
Renesas 89H32T8G2ZCBL technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FCBGA
Package Description
Flip Chip Ball Grid Array
Lead Shape
Ball
Pin Count
484
PCB
484
Package Length (mm)
23
Package Width (mm)
23
Package Height (mm)
2.72(Max)
Seated Plane Height (mm)
3.32(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
PCIe Generation
Gen2
Type
I/O Expansion Switch
PCIe Revision
2
Number of Lanes
32
Number of Ports
8
Traffic Class
8
Typical Single Supply Voltage
1V
Maximum Power Dissipation
9.71W
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
SAN34
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Renesas 89H32T8G2ZCBL Datasheet
Download the complete datasheet for Renesas 89H32T8G2ZCBL to view detailed technical specifications.
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