32-lane, 8-port PCI Express Gen2 I/O expansion switch. Features a 484-pin Flip Chip Ball Grid Array (FCBGA) package with a 23mm x 23mm footprint and 1mm pin pitch. Surface mountable with a typical single supply voltage of 1V and maximum power dissipation of 9.71W. Operates within a temperature range of 0°C to 70°C.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
Renesas 89H32T8G2ZCBLI technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Package Description | Flip Chip Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 484 |
| PCB | 484 |
| Package Length (mm) | 23 |
| Package Width (mm) | 23 |
| Package Height (mm) | 2.72(Max) |
| Seated Plane Height (mm) | 3.32(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| PCIe Generation | Gen2 |
| Type | I/O Expansion Switch |
| PCIe Revision | 2 |
| Number of Lanes | 32 |
| Number of Ports | 8 |
| Traffic Class | 8 |
| Typical Single Supply Voltage | 1V |
| Maximum Power Dissipation | 9.71W |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
Compliance
| Cage Code | SAN34 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Renesas 89H32T8G2ZCBLI Datasheet
Download the complete datasheet for Renesas 89H32T8G2ZCBLI to view detailed technical specifications.
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