System interconnect switch featuring 48 lanes and 12 ports, supporting PCIe Gen2 (Revision 2) with a bandwidth of 5 Gbps per lane. This surface-mount component is housed in a 676-pin Flip Chip Ball Grid Array (FCBGA) package measuring 27x27 mm with a 1 mm pin pitch. It operates with a typical single supply voltage of 1V or 2.5V and has a maximum power dissipation of 12.22W, functioning across an operating temperature range of -40°C to 85°C.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
Renesas 89H48T12G2ZCBLI8 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FCBGA
Package Description
Flip Chip Ball Grid Array
Lead Shape
Ball
Pin Count
676
PCB
676
Package Length (mm)
27
Package Width (mm)
27
Seated Plane Height (mm)
3.4
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
PCIe Generation
Gen2
Type
System Interconnect Switch
PCIe Revision
2
Number of Lanes
48
Number of Ports
12
Number of Channels
1
Traffic Class
8
Bandwidth
5Gbps
Typical Single Supply Voltage
1|2.5V
Maximum Power Dissipation
12.22W
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
SAN34
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Renesas 89H48T12G2ZCBLI8 Datasheet
Download the complete datasheet for Renesas 89H48T12G2ZCBLI8 to view detailed technical specifications.
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