System interconnect switch featuring 48 lanes and 12 ports, supporting PCIe Gen2 (Revision 2) with a bandwidth of 5 Gbps per lane. This surface-mount component is housed in a 676-pin Flip Chip Ball Grid Array (FCBGA) package measuring 27x27 mm with a 1 mm pin pitch. It operates with a typical single supply voltage of 1V or 2.5V and has a maximum power dissipation of 12.22W, functioning across an operating temperature range of -40°C to 85°C.
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Renesas 89H48T12G2ZCBLI8 technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Package Description | Flip Chip Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 676 |
| PCB | 676 |
| Package Length (mm) | 27 |
| Package Width (mm) | 27 |
| Seated Plane Height (mm) | 3.4 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| PCIe Generation | Gen2 |
| Type | System Interconnect Switch |
| PCIe Revision | 2 |
| Number of Lanes | 48 |
| Number of Ports | 12 |
| Number of Channels | 1 |
| Traffic Class | 8 |
| Bandwidth | 5Gbps |
| Typical Single Supply Voltage | 1|2.5V |
| Maximum Power Dissipation | 12.22W |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | SAN34 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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