The 89H64H16AG2ZCBLGI is a System Interconnect Switch from Renesas, packaged in a Flip Chip Ball Grid Array (FCBGA) with 1156 pins. It is designed for Surface Mount applications and has a seated plane height of 2.82mm. The device operates within a temperature range and is compliant with PCIe Gen2 standards.
Sign in to ask questions about the Renesas 89H64H16AG2ZCBLGI datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
Renesas 89H64H16AG2ZCBLGI technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Package Description | Flip Chip Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 1156 |
| PCB | 1156 |
| Package Length (mm) | 35 |
| Package Width (mm) | 35 |
| Seated Plane Height (mm) | 2.82 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| PCIe Generation | Gen2 |
| Type | System Interconnect Switch |
| Number of Lanes | 64 |
| Number of Ports | 16 |
| Number of Channels | 1 |
| Traffic Class | 8 |
| Cage Code | SAN34 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Renesas 89H64H16AG2ZCBLGI to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
