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Technical Specifications
Renesas 89H64H16G3ZABLG technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Package Description | Flip Chip Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 1156 |
| PCB | 1156 |
| Package Length (mm) | 35 |
| Package Width (mm) | 35 |
| Package Height (mm) | 2.73(Max) |
| Seated Plane Height (mm) | 3.07 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| PCIe Generation | Gen3 |
| Number of Lanes | 64 |
| Number of Ports | 16 |
Compliance
| Cage Code | SAN34 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Renesas 89H64H16G3ZABLG Datasheet
Download the complete datasheet for Renesas 89H64H16G3ZABLG to view detailed technical specifications.
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