The 89H64H16G3ZABLGI is a 1156-pin Ball Grid Array Flip Chip Ball Grid Array switch from Renesas. It is designed for surface mount applications and has a package length of 35mm, width of 35mm, and a maximum height of 2.73mm. The seated plane height is 3.07mm and the pin pitch is 1mm. The package material is plastic and it supports PCIe Gen3 with 64 lanes and 16 ports.
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Renesas 89H64H16G3ZABLGI technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Package Description | Flip Chip Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 1156 |
| PCB | 1156 |
| Package Length (mm) | 35 |
| Package Width (mm) | 35 |
| Package Height (mm) | 2.73(Max) |
| Seated Plane Height (mm) | 3.07 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| PCIe Generation | Gen3 |
| Number of Lanes | 64 |
| Number of Ports | 16 |
| Cage Code | SAN34 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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