This 1156-pin Ball Grid Array (BGA) surface mount integrated circuit is a PCIe Gen3 switch with 64 lanes and 16 ports. It features a flip chip ball grid array package with a seated plane height of 3.07mm and a maximum package height of 2.73mm. The package is made of plastic and has a pin pitch of 1mm. It is designed for surface mount applications and is suitable for use in a variety of electronic systems.
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Renesas 89H64H16G3ZABLI technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Package Description | Flip Chip Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 1156 |
| PCB | 1156 |
| Package Length (mm) | 35 |
| Package Width (mm) | 35 |
| Package Height (mm) | 2.73(Max) |
| Seated Plane Height (mm) | 3.07 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| PCIe Generation | Gen3 |
| Number of Lanes | 64 |
| Number of Ports | 16 |
| Cage Code | SAN34 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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