System interconnect switch featuring 16 lanes and 4 ports, supporting PCIe Gen2 revision 2. This component offers 1 channel with a bandwidth of 5 Gbps per lane. It is housed in a 324-pin Flip Chip Ball Grid Array (FCBGA) package, measuring 19x19x2.82mm, designed for surface mounting. Operating voltage ranges from 1V to 3.3V, with a maximum power dissipation of 2.87W and an operating temperature range of -40°C to 85°C.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
Renesas 89HPES16T4AG2ALGI technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Package Description | Flip Chip Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 324 |
| PCB | 324 |
| Package Length (mm) | 19 |
| Package Width (mm) | 19 |
| Package Height (mm) | 2.82(Max) |
| Seated Plane Height (mm) | 3.02 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| PCIe Generation | Gen2 |
| Type | System Interconnect Switch |
| PCIe Revision | 2 |
| Number of Lanes | 16 |
| Number of Ports | 4 |
| Number of Channels | 1 |
| Traffic Class | 8 |
| Bandwidth | 5Gbps |
| Typical Single Supply Voltage | 1|2.5|3.3V |
| Maximum Power Dissipation | 2.87W |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | SAN34 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Renesas 89HPES16T4AG2ALGI Datasheet
Download the complete datasheet for Renesas 89HPES16T4AG2ALGI to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.