System interconnect switch with 16 lanes and 4 ports, supporting PCIe Gen2 (Revision 2) with a bandwidth of 5 Gbps per lane. This integrated circuit features a single channel and operates with typical single supply voltages of 1V, 2.5V, or 3.3V. Packaged in a 324-pin Flip Chip Ball Grid Array (FCBGA) measuring 19mm x 19mm with a 2.82mm maximum height, it is designed for surface mount applications. Operating across a temperature range of -40°C to 85°C, this component offers a maximum power dissipation of 2.87W.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
Renesas 89HPES16T4AG2ALGI8 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FCBGA
Package Description
Flip Chip Ball Grid Array
Lead Shape
Ball
Pin Count
324
PCB
324
Package Length (mm)
19
Package Width (mm)
19
Package Height (mm)
2.82(Max)
Seated Plane Height (mm)
3.02
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
PCIe Generation
Gen2
Type
System Interconnect Switch
PCIe Revision
2
Number of Lanes
16
Number of Ports
4
Number of Channels
1
Traffic Class
8
Bandwidth
5Gbps
Typical Single Supply Voltage
1|2.5|3.3V
Maximum Power Dissipation
2.87W
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
SAN34
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Renesas 89HPES16T4AG2ALGI8 Datasheet
Download the complete datasheet for Renesas 89HPES16T4AG2ALGI8 to view detailed technical specifications.
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