System interconnect switch with 16 lanes and 4 ports, supporting PCIe Gen2 (Revision 2) with a bandwidth of 5 Gbps per lane. This integrated circuit features a single channel and operates with typical single supply voltages of 1V, 2.5V, or 3.3V. Packaged in a 324-pin Flip Chip Ball Grid Array (FCBGA) measuring 19mm x 19mm with a 2.82mm maximum height, it is designed for surface mount applications. Operating across a temperature range of -40°C to 85°C, this component offers a maximum power dissipation of 2.87W.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
Renesas 89HPES16T4AG2ALGI8 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Package Description | Flip Chip Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 324 |
| PCB | 324 |
| Package Length (mm) | 19 |
| Package Width (mm) | 19 |
| Package Height (mm) | 2.82(Max) |
| Seated Plane Height (mm) | 3.02 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| PCIe Generation | Gen2 |
| Type | System Interconnect Switch |
| PCIe Revision | 2 |
| Number of Lanes | 16 |
| Number of Ports | 4 |
| Number of Channels | 1 |
| Traffic Class | 8 |
| Bandwidth | 5Gbps |
| Typical Single Supply Voltage | 1|2.5|3.3V |
| Maximum Power Dissipation | 2.87W |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | SAN34 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Renesas 89HPES16T4AG2ALGI8 Datasheet
Download the complete datasheet for Renesas 89HPES16T4AG2ALGI8 to view detailed technical specifications.
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