PackageTSSOP
MountingSurface Mount
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Technical Specifications
Renesas 9EPRS475BGLF technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP
Package Description
Thin Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
56
PCB
56
Package Length (mm)
14.1(Max)
Package Width (mm)
6.2(Max)
Package Height (mm)
1.05(Max)
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-153EE
Number of Outputs per Chip
17
Input Logic Level
Crystal
Clock Input Frequency
14.31818(Typ)MHz
Min Operating Supply Voltage
3.135V
Max Operating Supply Voltage
3.465V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
SAN34
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Renesas 9EPRS475BGLF Datasheet
Download the complete datasheet for Renesas 9EPRS475BGLF to view detailed technical specifications.
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