PackageMLF EP
MountingSurface Mount
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Technical Specifications
Renesas 9FGV0231AKLF technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
MLF EP
Package Description
Micro Lead Frame, Exposed Pad
Lead Shape
No Lead
Pin Count
24
PCB
24
Package Length (mm)
4
Package Width (mm)
4
Package Height (mm)
0.88
Seated Plane Height (mm)
0.9
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Number of Outputs per Chip
3
Input Logic Level
Crystal
Output Logic Level
HCSL|LVCMOS
Clock Input Frequency
23 to 27MHz
Min Operating Supply Voltage
1.7V
Max Operating Supply Voltage
1.9V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
SAN34
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Renesas 9FGV0231AKLF Datasheet
Download the complete datasheet for Renesas 9FGV0231AKLF to view detailed technical specifications.
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