The AMB0680L4RJ8 is a Ball Grid Array IC from Renesas, packaged in a 24.5mm x 19.5mm x 1.9mm FCBGA with 655 pins. It is designed for surface mount applications and features a plastic package material. The IC has a seated plane height of 2.55mm (max) and a pin pitch of 0.8mm.
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Renesas AMB0680L4RJ8 technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Lead Shape | Ball |
| Pin Count | 655 |
| PCB | 655 |
| Package Length (mm) | 24.5 |
| Package Width (mm) | 19.5 |
| Package Height (mm) | 1.9 |
| Seated Plane Height (mm) | 2.55(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Cage Code | SAN34 |
| EU RoHS | Yes with Exemption |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Renesas AMB0680L4RJ8 to view detailed technical specifications.
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