8-channel non-inverting 3-state CMOS buffer/line driver in a 20-pin TSSOP package. This surface-mount integrated circuit features 8 inputs and 8 outputs, utilizing HC logic family and CMOS process technology. The thin shrink small outline package has a 0.65mm pin pitch, a package length of 6.5mm, and a width of 4.4mm, with a maximum height of 1mm. Operating temperature range is -40°C to 85°C.
PackageTSSOP
MountingSurface Mount
PolarityNon-Inverting
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Technical Specifications
Renesas HD74HC244TELL technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSSOP |
| Package Description | Thin Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 20 |
| PCB | 20 |
| Package Length (mm) | 6.5 |
| Package Width (mm) | 4.4 |
| Package Height (mm) | 1(Max) |
| Seated Plane Height (mm) | 1.1(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Logic Family | HC |
| Logic Function | Buffer/Line Driver |
| Number of Elements per Chip | 2 |
| Number of Inputs per Chip | 8 |
| Number of Outputs per Chip | 8 |
| Process Technology | CMOS |
| Polarity | Non-Inverting |
| Output Type | 3-State |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | SAN34 |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Datasheet
Renesas HD74HC244TELL Datasheet
Download the complete datasheet for Renesas HD74HC244TELL to view detailed technical specifications.
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