1M-bit UV EPROM memory IC, featuring a 128K x 8 organization and a maximum access time of 200 ns. This through-hole component utilizes a Ceramic Dual In-Line Package (CDIP) with 32 pins and a 2.54 mm pin pitch. Operating at a typical 5V supply, it supports in-system programming and requires a 12.5V programming voltage. The device offers a maximum operating current of 30 mA and operates within a temperature range of 0°C to 70°C.
PackageCDIP
MountingThrough Hole
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Technical Specifications
Renesas HN27C101G-20 technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
CDIP
Package Description
Ceramic Dual In Line Package
Lead Shape
Through Hole
Pin Count
32
PCB
32
Package Length (mm)
41.91
Package Width (mm)
14.66
Package Height (mm)
5.89(Max) - 0.38(Min)
Seated Plane Height (mm)
5.89(Max)
Pin Pitch (mm)
2.54
Package Material
Ceramic
Mounting
Through Hole
Density
1Mbit
Maximum Access Time
200ns
Interface Type
Parallel
Maximum Operating Current
30mA
Organization
128Kx8
Reprogramming Technique
UV
Typical Operating Supply Voltage
5V
In-System Programmability
In System|External
Density in Bits
1048576bit
Max Operating Supply Voltage
5.25V
Min Operating Supply Voltage
4.75V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Programming Voltage
12.5V
Compliance
Cage Code
SAN34
EU RoHS
No
HTS Code
8542320061
Schedule B
8542320060
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Renesas HN27C101G-20 Datasheet
Download the complete datasheet for Renesas HN27C101G-20 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.