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Technical Specifications
Renesas HN27C256G-25 technical specifications.
General
| Basic Package Type | Through Hole |
| Package Family Name | DIP |
| Package/Case | CDIP |
| Package Description | Ceramic Dual In Line Package |
| Lead Shape | Through Hole |
| Pin Count | 28 |
| PCB | 28 |
| Package Length (mm) | 36.83 |
| Package Width (mm) | 14.66 |
| Package Height (mm) | 5.89(Max) - 0.38(Min) |
| Seated Plane Height (mm) | 5.89(Max) |
| Pin Pitch (mm) | 2.54 |
| Package Material | Ceramic |
| Mounting | Through Hole |
| Density | 256Kbit |
| Maximum Access Time | 250ns |
| Interface Type | Parallel |
| Organization | 32Kx8 |
| Reprogramming Technique | UV |
| Density in Bits | 262144bit |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Programming Voltage | 12.5V |
Compliance
| Cage Code | SAN34 |
| EU RoHS | No |
| HTS Code | 8542320061 |
| Schedule B | 8542320060 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Renesas HN27C256G-25 Datasheet
Download the complete datasheet for Renesas HN27C256G-25 to view detailed technical specifications.
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