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Technical Specifications
Renesas LDS6107PYGI8 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SSOP
Package Description
Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
28
PCB
28
Package Length (mm)
10.2
Package Width (mm)
5.3
Package Height (mm)
1.73
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-150AH
Number of Channels per Chip
13
Type
Capacitive
Max Operating Supply Voltage
5.5V
Interface Type
I2C/SMBus/SPI
Compliance
Cage Code
SAN34
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Renesas LDS6107PYGI8 Datasheet
Download the complete datasheet for Renesas LDS6107PYGI8 to view detailed technical specifications.
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