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Technical Specifications
Renesas LDS6126PYGI8 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SSOP
Package Description
Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
28
PCB
28
Package Length (mm)
10.2
Package Width (mm)
5.3
Package Height (mm)
1.73
Seated Plane Height (mm)
1.86
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-150AH
Number of Channels per Chip
11
Type
Capacitive
Max Operating Supply Voltage
5.5V
Interface Type
I2C/SMBus/SPI
Compliance
Cage Code
SAN34
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Renesas LDS6126PYGI8 Datasheet
Download the complete datasheet for Renesas LDS6126PYGI8 to view detailed technical specifications.
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