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Renesas LDS6201DCGI8 technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOIC N |
| Package Description | Small Outline IC Narrow Body |
| Lead Shape | Gull-wing |
| Pin Count | 16 |
| PCB | 16 |
| Package Length (mm) | 9.93 |
| Package Width (mm) | 3.94 |
| Package Height (mm) | 1.47 |
| Seated Plane Height (mm) | 1.63 |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-012AC |
| Number of Channels per Chip | 2 |
| Type | Capacitive |
| Max Operating Supply Voltage | 5.5V |
| Interface Type | I2C |
| Cage Code | SAN34 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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