PackageSOIC
MountingSurface Mount
Quick Jump:
Technical Specifications
Renesas MC88LV926EG technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOIC
Package Description
Small Outline IC
Lead Shape
Gull-wing
Pin Count
20
PCB
20
Package Length (mm)
12.8
Package Width (mm)
7.6
Package Height (mm)
2.34
Seated Plane Height (mm)
2.54
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-013AC
Number of Outputs per Chip
6
Input Logic Level
CMOS|TTL
Output Logic Level
CMOS
Clock Input Frequency
5(Min)MHz
Min Operating Supply Voltage
3V
Max Operating Supply Voltage
3.6V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
SAN34
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Renesas MC88LV926EG Datasheet
Download the complete datasheet for Renesas MC88LV926EG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.