Asynchronous SRAM chip, 8M-bit density, organized as 512K words by 16 bits. Features a maximum access time of 55 ns and operates from a 3V supply voltage (2.4V to 3.6V). This surface-mount component is housed in a 48-pin TFBGA package with a 0.75mm pin pitch, measuring 8.5mm x 7.5mm x 0.8mm. Operating temperature range is -40°C to 85°C, with a typical operating current of 30 mA.
PackageTFBGA
MountingSurface Mount
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Technical Specifications
Renesas R1LV0816ABG-5SI technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TFBGA |
| Package Description | Thin Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 48 |
| PCB | 48 |
| Package Length (mm) | 8.5 |
| Package Width (mm) | 7.5 |
| Package Height (mm) | 0.8(Max) |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.75 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 8Mbit |
| Address Bus Width | 19bit |
| Maximum Access Time | 55ns |
| Timing Type | Asynchronous |
| Density in Bits | 8388608bit |
| Maximum Operating Current | 30mA |
| Typical Operating Supply Voltage | 3V |
| Number of Bits per Word | 16bit |
| Number of Ports | 1 |
| Number of Words | 512K |
| Min Operating Supply Voltage | 2.4V |
| Max Operating Supply Voltage | 3.6V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | SAN34 |
| EU RoHS | No |
| HTS Code | 8542320041 |
| Schedule B | 8542320040 |
| ECCN | 3A991.b.2.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Renesas R1LV0816ABG-5SI Datasheet
Download the complete datasheet for Renesas R1LV0816ABG-5SI to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.