Asynchronous SRAM chip, 8M-bit density, organized as 512K words by 16 bits. Features a maximum access time of 55 ns and operates from a 2.4V to 3.6V supply, with a typical voltage of 3V. Housed in a 44-pin TSOP-II (Thin Small Outline Package Type II) surface-mount package with gull-wing leads. This plastic package has a maximum length of 18.41mm, width of 10.16mm, and height of 1mm, with a 0.8mm pin pitch. Operates across a temperature range of -40°C to 85°C.
PackageTSOP-II
MountingSurface Mount
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Technical Specifications
Renesas R1LV0816ASB-5SI technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSOP-II
Package Description
Thin Small Outline Package (Type II)
Lead Shape
Gull-wing
Pin Count
44
PCB
44
Package Length (mm)
18.41(Max)
Package Width (mm)
10.16(Max)
Package Height (mm)
1
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-024AC
Density
8Mbit
Address Bus Width
19bit
Maximum Access Time
55ns
Timing Type
Asynchronous
Density in Bits
8388608bit
Maximum Operating Current
35mA
Typical Operating Supply Voltage
3V
Number of Bits per Word
16bit
Number of Ports
1
Number of Words
512K
Min Operating Supply Voltage
2.4V
Max Operating Supply Voltage
3.6V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
SAN34
EU RoHS
Yes
HTS Code
8542320041
Schedule B
8542320040
ECCN
3A991.b.2.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Renesas R1LV0816ASB-5SI Datasheet
Download the complete datasheet for Renesas R1LV0816ASB-5SI to view detailed technical specifications.
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