The R5F61658MD50FPV is a microcontroller with a lead-frame SMT package type, featuring 120 pins and a package size of 14mm x 14mm x 1.4mm. It has a seated plane height of 1.7mm and a pin pitch of 0.4mm. The package is made of plastic and weighs 0.7g. The microcontroller is designed for surface mount applications and conforms to the MS-026BFB Jedec standard.
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Renesas R5F61658MD50FPV technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | QFP |
| Package/Case | LFQFP |
| Lead Shape | Gull-wing |
| Pin Count | 120 |
| PCB | 120 |
| Package Length (mm) | 14 |
| Package Width (mm) | 14 |
| Package Height (mm) | 1.4 |
| Seated Plane Height (mm) | 1.7(Max) |
| Pin Pitch (mm) | 0.4 |
| Package Weight (g) | 0.7 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-026BFB |
| Cage Code | SAN34 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Renesas R5F61658MD50FPV to view detailed technical specifications.
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