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Technical Specifications
Renesas TSI382A-66IL technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | CABGA |
| Package Description | Chip Array Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 144 |
| PCB | 144 |
| Package Length (mm) | 10 |
| Package Width (mm) | 10 |
| Package Height (mm) | 1.06 |
| Seated Plane Height (mm) | 1.45(Max) |
| Pin Pitch (mm) | 0.8 |
| Mounting | Surface Mount |
| PCI Frequency | 66MHz |
| PCI Data Bus Width | 32bit |
| Bridge Type | PCIe to PCI |
| Min Operating Temperature | -40°C |
| ECC Support | No |
| GPIO | No |
Compliance
| Cage Code | SAN34 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Renesas TSI382A-66IL Datasheet
Download the complete datasheet for Renesas TSI382A-66IL to view detailed technical specifications.
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