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Technical Specifications
Renesas uPD65977S1-xxx-B6 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
256
PCB
256
Package Length (mm)
27
Package Width (mm)
27
Package Height (mm)
1.53
Package Material
Plastic
Mounting
Surface Mount
Process Technology
CMOS
Processing Unit
Microprocessor
Max Operating Supply Voltage
3.6V
Typical Operating Supply Voltage
3.3V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
SAN34
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Renesas uPD65977S1-xxx-B6 Datasheet
Download the complete datasheet for Renesas uPD65977S1-xxx-B6 to view detailed technical specifications.
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