The BD8118FM-E2 is a 30-pin power management IC available in a heat sinked small outline package with a lead-frame SMT construction. It has a maximum operating temperature range of -40°C to 95°C and can withstand a maximum supply voltage of 30V. The device is designed for surface mount applications and has a maximum power dissipation of 2200mW. The package dimensions are 18.5mm in length, 7.5mm in width, and 2.2mm in height, with a seated plane height of 2.31mm and a pin pitch of 0.8mm.
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| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | HSOP-M |
| Package Description | Heat Sinked Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 30 |
| PCB | 28 |
| Tab | 2Tab |
| Package Length (mm) | 18.5 |
| Package Width (mm) | 7.5 |
| Package Height (mm) | 2.2 |
| Seated Plane Height (mm) | 2.31 |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 95°C |
| Max Operating Supply Voltage | 30V |
| Maximum Power Dissipation | 2200mW |
| Min Operating Supply Voltage | 4.5V |
| Typical Operating Supply Voltage | 5|9|12|15|18|24V |
| Cage Code | S5518 |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | Yes |
| Radiation Hardening | No |
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