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Technical Specifications
Rohm BR25H010FJ-WCE2 technical specifications.
General
| Package/Case | SOIC |
| Density | 1Kb |
| Interface | SPI, Serial |
| Max Operating Temperature | 125°C |
| Max Supply Voltage | 5.5V |
| Memory Type | EEPROM, |
| Min Operating Temperature | -40°C |
| Min Supply Voltage | 2.5V |
| Mount | Surface Mount |
| Package Quantity | 2500 |
| Packaging | Tape and Reel |
| RoHS Compliant | Yes |
Compliance
| RoHS | Compliant |
Datasheet
Rohm BR25H010FJ-WCE2 Datasheet
Download the complete datasheet for Rohm BR25H010FJ-WCE2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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