Frequency2MHz
PackageSOIC
MountingSurface Mount
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Technical Specifications
Rohm BR25L010FJ-WE2 technical specifications.
General
Access Time
5us
Package/Case
SOIC
Contact Plating
Copper, Tin
Density
1Kb
Interface
SPI, Serial, 3-WIRE
Lead Free
Lead Free
Max Frequency
2MHz
Max Operating Temperature
85°C
Max Supply Voltage
5.5V
Memory Size
1Kb
Memory Type
EEPROM,
Min Operating Temperature
-40°C
Min Supply Voltage
1.8V
Mount
Surface Mount
Operating Supply Voltage
5V
Organization
128 x 8
Package Quantity
1
Packaging
Tape and Reel
RoHS Compliant
Yes
Compliance
RoHS
Compliant
Datasheet
Rohm BR25L010FJ-WE2 Datasheet
Download the complete datasheet for Rohm BR25L010FJ-WE2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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