Frequency20MHz
PackageSOIC
MountingSurface Mount
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Technical Specifications
Rohm BR25S256FJ-WE2 technical specifications.
General
Package/Case
SOIC
Contact Plating
Copper, Tin
Density
256Kb
Frequency
20MHz
Interface
SPI, Serial, 3-WIRE
Lead Free
Lead Free
Max Operating Temperature
85°C
Max Supply Voltage
5.5V
Memory Type
EEPROM,
Min Operating Temperature
-40°C
Min Supply Voltage
1.7V
Mount
Surface Mount
Package Quantity
1
Packaging
Cut Tape
RoHS Compliant
Yes
Compliance
RoHS
Compliant
Datasheet
Rohm BR25S256FJ-WE2 Datasheet
Download the complete datasheet for Rohm BR25S256FJ-WE2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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