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Rohm BU2050F-E2 technical specifications.
| Package/Case | SOIC |
| Contact Plating | Copper, Tin |
| Lead Free | Lead Free |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Mount | Surface Mount |
| Package Quantity | 1 |
| Packaging | Tape and Reel |
| RoHS Compliant | Yes |
| RoHS | Compliant |
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