This telecom IC from Rohm is packaged in TSSOP and features a maximum power dissipation of 450mW. It operates within a temperature range of -20°C to 70°C. The IC is lead-free and RoHS compliant, making it suitable for surface mount applications.
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Rohm BU8768FV-E2 technical specifications.
| Package/Case | TSSOP |
| Lead Free | Lead Free |
| Max Operating Temperature | 70°C |
| Min Operating Temperature | -20°C |
| Max Power Dissipation | 450mW |
| Mount | Surface Mount |
| Number of Circuits | 1 |
| Package Quantity | 2500 |
| Packaging | Tape and Reel |
| RoHS Compliant | Yes |
| RoHS | Compliant |
No datasheet is available for this part.
