128Mbit SDRAM chip, organized as 8Mx16, featuring a 16-bit data bus width and a maximum clock rate of 133 MHz. This DRAM component offers 4 internal banks, each with 2M words, and a maximum access time of 6 ns. Housed in a 54-pin TSOP-II package with gull-wing leads for surface mounting, it operates at a typical supply voltage of 3.3V. The plastic package measures 22.62mm in length and 10.16mm in width, with a pin pitch of 0.8mm.
PackageTSOP-II
MountingSurface Mount
Quick Jump:
Technical Specifications
Samsung K4S281632D-TC75T technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSOP-II |
| Package Description | Thin Small Outline Package (Type II) |
| Lead Shape | Gull-wing |
| Pin Count | 54 |
| PCB | 54 |
| Package Length (mm) | 22.62(Max) |
| Package Width (mm) | 10.16 |
| Package Height (mm) | 1 |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-024FA |
| Density | 128Mbit |
| Type | SDRAM |
| Organization | 8Mx16 |
| Data Bus Width | 16bit |
| Maximum Clock Rate | 133MHz |
| Number of Internal Banks | 4 |
| Number of Words per Bank | 2M |
| Maximum Access Time | 6|5.4ns |
| Density in Bits | 134217728bit |
| Address Bus Width | 14bit |
| Maximum Operating Current | 140mA |
| Typical Operating Supply Voltage | 3.3V |
| Max Operating Supply Voltage | 3.6V |
| Min Operating Supply Voltage | 3V |
Compliance
| Cage Code | 1542F |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Datasheet
Samsung K4S281632D-TC75T Datasheet
Download the complete datasheet for Samsung K4S281632D-TC75T to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.