The K4S643232F-TC70 is a 86-pin TSOP-II Lead-Frame SMT DRAM IC from Samsung. It features a package length of 22.62mm, width of 10.16mm, and height of 1mm. The seated plane height is 1.2mm max, with a pin pitch of 0.5mm. The package material is plastic and it is designed for surface mount applications.
PackageTSOP-II
MountingSurface Mount
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Technical Specifications
Samsung K4S643232F-TC70 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSOP-II |
| Package Description | Thin Small Outline Package (Type II) |
| Lead Shape | Gull-wing |
| Pin Count | 86 |
| PCB | 86 |
| Package Length (mm) | 22.62(Max) |
| Package Width (mm) | 10.16 |
| Package Height (mm) | 1 |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | 1542F |
| EU RoHS | No |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Samsung K4S643232F-TC70 Datasheet
Download the complete datasheet for Samsung K4S643232F-TC70 to view detailed technical specifications.
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