Async Single SRAM chip, 1M-bit density, organized as 128K words by 8 bits. Features a maximum access time of 70 ns and operates with a typical supply voltage of 5V, within a 4.5V to 5.5V range. Packaged in a 32-pin TSOP-I (Thin Small Outline Package Type I) with gull-wing leads for surface mounting. This plastic package has a maximum length of 8.4mm and a pin pitch of 0.5mm. Operating temperature range is 0°C to 70°C.
PackageTSOP-I
MountingSurface Mount
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Technical Specifications
Samsung K6T1008C2C-TB70T00 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSOP-I
Package Description
Thin Small Outline Package (Type I)
Lead Shape
Gull-wing
Pin Count
32
PCB
32
Package Length (mm)
8.4(Max)
Package Width (mm)
18.4
Package Height (mm)
1
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Density
1Mbit
Address Bus Width
17bit
Maximum Access Time
70ns
Timing Type
Asynchronous
Data Rate Architecture
SDR
Density in Bits
1048576bit
Maximum Operating Current
60mA
Typical Operating Supply Voltage
5V
Number of Bits per Word
8bit
Number of Ports
1
Number of Words
128K
Min Operating Supply Voltage
4.5V
Max Operating Supply Voltage
5.5V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
1542F
EU RoHS
No
HTS Code
8542320041
Schedule B
8542320040
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Samsung K6T1008C2C-TB70T00 Datasheet
Download the complete datasheet for Samsung K6T1008C2C-TB70T00 to view detailed technical specifications.
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