64G-bit Serial e-MMC NAND Flash memory, featuring a 169-pin TFBGA package with dimensions of 16mm x 12mm x 1mm. This surface-mount component operates at 3.3V and supports 1/4/8-bit data transfer. It offers a synchronous interface with a sectored, symmetrical block organization and includes boot block functionality. Operating temperature range is -25°C to 85°C.
PackageTFBGA
MountingSurface Mount
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Technical Specifications
Sandisk SDIN5C2-8G-L technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TFBGA
Package Description
Thin Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
169
PCB
169
Package Length (mm)
16
Package Width (mm)
12
Package Height (mm)
1
Seated Plane Height (mm)
1.2
Package Material
Plastic
Mounting
Surface Mount
Density
64Gbit
Interface Type
Serial e-MMC
Block Organization
Symmetrical
Architecture
Sectored
Timing Type
Synchronous
Number of Words
64G/16G/8G
Boot Block
Yes
Typical Operating Supply Voltage
3.3V
Number of Bits per Word
1/4/8bit
Min Operating Temperature
-25°C
Max Operating Temperature
85°C
Compliance
Cage Code
03LB0
EU RoHS
Yes
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU
Datasheet
Sandisk SDIN5C2-8G-L Datasheet
Download the complete datasheet for Sandisk SDIN5C2-8G-L to view detailed technical specifications.
No datasheet is available for this part.