64G-bit Serial e-MMC NAND Flash memory, featuring a 169-pin TFBGA package with dimensions of 16mm x 12mm x 1mm. This surface-mount component operates at 3.3V and supports 1/4/8-bit data transfer. It offers a synchronous interface with a sectored, symmetrical block organization and includes boot block functionality. Operating temperature range is -25°C to 85°C.
PackageTFBGA
MountingSurface Mount
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Technical Specifications
Sandisk SDIN5C2-8G-L technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TFBGA |
| Package Description | Thin Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 169 |
| PCB | 169 |
| Package Length (mm) | 16 |
| Package Width (mm) | 12 |
| Package Height (mm) | 1 |
| Seated Plane Height (mm) | 1.2 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 64Gbit |
| Interface Type | Serial e-MMC |
| Block Organization | Symmetrical |
| Architecture | Sectored |
| Timing Type | Synchronous |
| Number of Words | 64G/16G/8G |
| Boot Block | Yes |
| Typical Operating Supply Voltage | 3.3V |
| Number of Bits per Word | 1/4/8bit |
| Min Operating Temperature | -25°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 03LB0 |
| EU RoHS | Yes |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU |
Datasheet
Sandisk SDIN5C2-8G-L Datasheet
Download the complete datasheet for Sandisk SDIN5C2-8G-L to view detailed technical specifications.
No datasheet is available for this part.