Search Results for &quot; M24128-DFMN6TP &quot;

128 Kbit Serial I<sup>2</sup>C Bus EEPROM

SOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

+12

M24128-BWMC6G

128Kbit Serial-I2C EEPROM, 16Kx8, 3.3V/5V, 8-Pin UFDFPN

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24128-BFMC6G

128Kb Serial-I2C EEPROM, 16Kx8, 1MHz, 8-Pin UFDFPN EP

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24128-BRMC6G

128Kbit Serial-I2C EEPROM, 16Kx8, 2.5-5V, 8-Pin UFDFPN EP

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24128-BRDW6T

16KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.169 INCH, TSSOP-8

0.169 INCH, TSSOP-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24128-BRMN6P

128Kb I2C EEPROM, 400kHz, SOIC, 5V, 900ns

SOP-8

Active

Access Time: 900ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 128Kb

+22

M24128-BRCS6G/K

128Kbit I2C EEPROM, 8-Pin WLCSP, 1MHz

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-BFCS6G/K

128Kb Serial-I2C EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-BWMN6P

128Kb I2C EEPROM, 400kHz, SOIC, 2.5-5.5V

SOP, SOP8,.25

Not Recommended

Access Time: 900ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 128Kb

M24128-BWMC6P

128Kbit I2C EEPROM, 8-Pin UFDFPN, 3.3V/5V, 1MHz

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24128-BWMN6T

16KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOP-8

0.150 INCH, PLASTIC, SOP-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24128-BFMC6P

128Kbit I2C EEPROM, 1MHz, 1.8-5V, 8-Pin UFDFPN

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24128-BWCS6P/K

128Kbit Serial-I2C EEPROM, 16Kx8, 3.3V/5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-BRMC6P

128Kbit Serial-I2C EEPROM, 16Kx8, 2.5-5V, 8-Pin UFDFPN EP

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24128-BWDW6T

16KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.169 INCH, TSSOP-8

0.169 INCH, TSSOP-8

Obsolete

Access Time: 450ns

Access Time-Max: 900ns

Package/Case: TSSOP

Density: 128Kb

+18

M24128-BFCS6P/K

128Kbit I2C EEPROM, 1.8-5V, 8-Pin WLCSP, 1MHz

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-BWCS6G/K

128Kb Serial I2C EEPROM, 8-Pin WLCSP, 3.3V/5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-BRMB6G

16KX8 I2C/2-WIRE SERIAL EEPROM, DSO8, 2 X 3 MM, ROHS COMPLIANT, UFDFPN-8

2 X 3 MM, ROHS COMPLIANT, UFDFPN-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24128-BWMC6TP

128Kbit Serial-I2C EEPROM, 16Kx8, 3.3V/5V, 8-Pin UFDFPN SMT

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24128-BRCS6TP/K

128Kbit I2C EEPROM, 16Kx8, 8-Pin WLCSP, 1MHz

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

Search Results for "M24128-DFMN6TP"

Filters

M24128-BFMN6TP

128 Kbit Serial I<sup>2</sup>C Bus EEPROM

SOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

+12

M24128-BWMC6G

128Kbit Serial-I2C EEPROM, 16Kx8, 3.3V/5V, 8-Pin UFDFPN

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24128-BFMC6G

128Kb Serial-I2C EEPROM, 16Kx8, 1MHz, 8-Pin UFDFPN EP

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24128-BRMC6G

128Kbit Serial-I2C EEPROM, 16Kx8, 2.5-5V, 8-Pin UFDFPN EP

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24128-BRDW6T

16KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.169 INCH, TSSOP-8

0.169 INCH, TSSOP-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24128-BRMN6P

128Kb I2C EEPROM, 400kHz, SOIC, 5V, 900ns

SOP-8

Active

Access Time: 900ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 128Kb

+22

M24128-BRCS6G/K

128Kbit I2C EEPROM, 8-Pin WLCSP, 1MHz

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-BFCS6G/K

128Kb Serial-I2C EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-BWMN6P

128Kb I2C EEPROM, 400kHz, SOIC, 2.5-5.5V

SOP, SOP8,.25

Not Recommended

Access Time: 900ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 128Kb

M24128-BWMC6P

128Kbit I2C EEPROM, 8-Pin UFDFPN, 3.3V/5V, 1MHz

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24128-BWMN6T

16KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOP-8

0.150 INCH, PLASTIC, SOP-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24128-BFMC6P

128Kbit I2C EEPROM, 1MHz, 1.8-5V, 8-Pin UFDFPN

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24128-BWCS6P/K

128Kbit Serial-I2C EEPROM, 16Kx8, 3.3V/5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-BRMC6P

128Kbit Serial-I2C EEPROM, 16Kx8, 2.5-5V, 8-Pin UFDFPN EP

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24128-BWDW6T

16KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.169 INCH, TSSOP-8

0.169 INCH, TSSOP-8

Obsolete

Access Time: 450ns

Access Time-Max: 900ns

Package/Case: TSSOP

Density: 128Kb

+18

M24128-BFCS6P/K

128Kbit I2C EEPROM, 1.8-5V, 8-Pin WLCSP, 1MHz

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-BWCS6G/K

128Kb Serial I2C EEPROM, 8-Pin WLCSP, 3.3V/5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-BRMB6G

16KX8 I2C/2-WIRE SERIAL EEPROM, DSO8, 2 X 3 MM, ROHS COMPLIANT, UFDFPN-8

2 X 3 MM, ROHS COMPLIANT, UFDFPN-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24128-BWMC6TP

128Kbit Serial-I2C EEPROM, 16Kx8, 3.3V/5V, 8-Pin UFDFPN SMT

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24128-BRCS6TP/K

128Kbit I2C EEPROM, 16Kx8, 8-Pin WLCSP, 1MHz

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package