Search Results for &quot; M95128-RDW6TP &quot;

16Kb I2C EEPROM, 400kHz, 900ns Access, TSSOP

TSSOP, TSSOP8,.25

Active

Access Time: 900ns

Access Time-Max: 900ns

Package/Case: TSSOP

Density: 16Kb

+24

BR24C01-RDW6TP

EEPROM, 1KX1, Serial, CMOS, PDSO8, MO-153AA, TSSOP-8

TSSOP, TSSOP8,.25

Obsolete

Access Time: 3500ns

Access Time-Max: 3500ns

Package/Case: TSSOP

Contact Plating: Copper, Tin

M95128-WMN6TP/P

128Kbit Serial-SPI EEPROM, 16Kx8, 3.3V/5V, 8-Pin SOIC

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M95128-DFMN6G

128Kbit Serial-SPI EEPROM, 1.8-5V, 8-Pin SOIC

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M95128-WMN4TG/K

128Kbit Serial-SPI EEPROM, 16Kx8, 3.3V/5V, 8-Pin SOIC, 20MHz

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M95128-DRMC3G/K

128Kbit Serial-SPI EEPROM, 8-Pin UFDFPN, 2.5-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95128-RCS6TG/K

128Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 2.5-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

BR24C02-RDW6TP

EEPROM, 2KX1, Serial, CMOS, PDSO8, MO-153AA, TSSOP-8

TSSOP, TSSOP8,.25

Obsolete

Access Time: 3500ns

Access Time-Max: 3500ns

Package/Case: TSSOP

Contact Plating: Copper, Tin

BR24C04-RDW6TP

IC EEPROM 4K I2C 100KHZ 8TSSOP

Not Recommended for New Design

Access Time: 3500ns

Access Time-Max: 3500ns

Package/Case: TSSOP

Contact Plating: Copper, Tin

BR95080-RDW6TP

EEPROM, 1KX8, 150ns, Serial, CMOS, PDSO8, MO-153, TSSOP-8

TSSOP, TSSOP8,.25

Obsolete

Access Time: 150ns

Access Time-Max: 150ns

Package/Case: TSSOP

Contact Plating: Copper, Tin

+14

M95128-DFDW6P

128Kbit SPI EEPROM, 1.8-5V, 8-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95128-DWMN4P/K

128Kbit Serial-SPI EEPROM, 16Kx8, 3.3V/5V, 8-Pin SOIC

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M95128-DRMN3P/K

128Kb Serial-SPI EEPROM, 16Kx8, 2.5-5V, 8-Pin SOIC, 20MHz

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M95128-DRMN3G/K

128Kbit Serial-SPI EEPROM, 2.5-5V, 8-Pin SOIC, 20MHz

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M95128-WMC4TP/K

128Kbit Serial-SPI EEPROM, 16Kx8, 3.3V/5V, 20MHz, 8-Pin UFDFPN

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95128-DFCS6P/K

128Kbit EEPROM Serial-SPI WLCSP 8-Pin 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95128-RCS6TP/K

128Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 2.5-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95128-DFMC6G

128Kbit Serial-SPI EEPROM, 8-Pin UFDFPN, 1.8-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95128-DFCS6G/K

128Kbit EEPROM Serial-SPI 1.8-5V WLCSP 8-Pin

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95128-WMN6TP

128Kb SPI EEPROM, 5MHz, 60ns Access, SOIC, 5.5V

0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

Active

Access Time: 60ns

Access Time-Max: 60ns

Package/Case: SOIC

Density: 128Kb

Search Results for "M95128-RDW6TP"

Filters

M24C16-RDW6TP

16Kb I2C EEPROM, 400kHz, 900ns Access, TSSOP

TSSOP, TSSOP8,.25

Active

Access Time: 900ns

Access Time-Max: 900ns

Package/Case: TSSOP

Density: 16Kb

+24

BR24C01-RDW6TP

EEPROM, 1KX1, Serial, CMOS, PDSO8, MO-153AA, TSSOP-8

TSSOP, TSSOP8,.25

Obsolete

Access Time: 3500ns

Access Time-Max: 3500ns

Package/Case: TSSOP

Contact Plating: Copper, Tin

M95128-WMN6TP/P

128Kbit Serial-SPI EEPROM, 16Kx8, 3.3V/5V, 8-Pin SOIC

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M95128-DFMN6G

128Kbit Serial-SPI EEPROM, 1.8-5V, 8-Pin SOIC

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M95128-WMN4TG/K

128Kbit Serial-SPI EEPROM, 16Kx8, 3.3V/5V, 8-Pin SOIC, 20MHz

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M95128-DRMC3G/K

128Kbit Serial-SPI EEPROM, 8-Pin UFDFPN, 2.5-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95128-RCS6TG/K

128Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 2.5-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

BR24C02-RDW6TP

EEPROM, 2KX1, Serial, CMOS, PDSO8, MO-153AA, TSSOP-8

TSSOP, TSSOP8,.25

Obsolete

Access Time: 3500ns

Access Time-Max: 3500ns

Package/Case: TSSOP

Contact Plating: Copper, Tin

BR24C04-RDW6TP

IC EEPROM 4K I2C 100KHZ 8TSSOP

Not Recommended for New Design

Access Time: 3500ns

Access Time-Max: 3500ns

Package/Case: TSSOP

Contact Plating: Copper, Tin

BR95080-RDW6TP

EEPROM, 1KX8, 150ns, Serial, CMOS, PDSO8, MO-153, TSSOP-8

TSSOP, TSSOP8,.25

Obsolete

Access Time: 150ns

Access Time-Max: 150ns

Package/Case: TSSOP

Contact Plating: Copper, Tin

+14

M95128-DFDW6P

128Kbit SPI EEPROM, 1.8-5V, 8-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95128-DWMN4P/K

128Kbit Serial-SPI EEPROM, 16Kx8, 3.3V/5V, 8-Pin SOIC

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M95128-DRMN3P/K

128Kb Serial-SPI EEPROM, 16Kx8, 2.5-5V, 8-Pin SOIC, 20MHz

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M95128-DRMN3G/K

128Kbit Serial-SPI EEPROM, 2.5-5V, 8-Pin SOIC, 20MHz

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M95128-WMC4TP/K

128Kbit Serial-SPI EEPROM, 16Kx8, 3.3V/5V, 20MHz, 8-Pin UFDFPN

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95128-DFCS6P/K

128Kbit EEPROM Serial-SPI WLCSP 8-Pin 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95128-RCS6TP/K

128Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 2.5-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95128-DFMC6G

128Kbit Serial-SPI EEPROM, 8-Pin UFDFPN, 1.8-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95128-DFCS6G/K

128Kbit EEPROM Serial-SPI 1.8-5V WLCSP 8-Pin

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95128-WMN6TP

128Kb SPI EEPROM, 5MHz, 60ns Access, SOIC, 5.5V

0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

Active

Access Time: 60ns

Access Time-Max: 60ns

Package/Case: SOIC

Density: 128Kb