Search Results for &quot; M95640-RMC6TG &quot;

128Kbit Serial-SPI EEPROM, 8-Pin UFDFPN, 2.5-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24512-RMC6TP

512Kbit Serial-I2C EEPROM, 64Kx8, 8-Pin UFDFPN, 2.5-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24LR04E-RMC6T/2

NFC/RFID EEPROM Tag 4Kbit Serial 1.8-5.5V Industrial 8-Pin UFDFPN

DFN

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24LR64E-RMC6T/2

NFC/RFID EEPROM IC, 64Kbit, 13.56MHz, 8-Pin UFDFPN, Industrial

DFN

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24LR16E-RMC6T/2

NFC/RFID EEPROM IC, 16Kbit, 8-Pin UFDFPN, Industrial

DFN

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

+16

M93C66-RMC6P

MICROWIRE BUS SERIAL EEPROM

UFDFP-8

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

+15

M95128-RMC3G/K

128Kb Serial-SPI EEPROM, 8-Pin UFDFPN, 2.5-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95128-RMC3P/K

128Kbit Serial-SPI EEPROM, 16Kx8, 2.5-5V, 8-Pin UFDFPN

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95128-RMC3TG/K

128Kbit Serial-SPI EEPROM, 8-Pin UFDFPN, 2.5-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95128-RMC3TP/K

128Kbit Serial-SPI EEPROM, 8-Pin UFDFPN, 2.5-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

RMC65DRAH

Conn Card Edge F 130 POS 2.54mm Solder RA Thru-Hole

Through Hole

Active

Card Thickness: 0.062inch

Color: Green

Contact Material: Bronze

Contact Plating: Gold

RMC65DREF

Conn Card Edge F 130 POS 2.54mm Solder Lug ST Panel Mount

Panel Mount

Active

Card Thickness: 0.062inch

Color: Green

Contact Material: Bronze

Contact Plating: Gold

RMC60DRYI

Conn Card Edge F 120 POS 2.54mm Solder ST Thru-Hole

Through Hole

Active

Color: Green

Contact Material: Bronze

Contact Plating: Gold

Contact Type: Full Bellows

RMC65DRYN

Conn Card Edge F 130 POS 2.54mm Solder ST Thru-Hole

Through Hole

Active

Color: Green

Contact Material: Bronze

Contact Plating: Gold

Contact Type: Full Bellows

RMC60DTEH

Conn Card Edge F 120 POS 2.54mm Solder Lug ST Panel Mount

Panel Mount

Active

Color: Green

Contact Material: Bronze

Contact Plating: Gold

Contact Type: Full Bellows

RMC60DREH

Conn Card Edge F 120 POS 2.54mm Solder Lug ST Panel Mount

Panel Mount

Active

Color: Green

Contact Material: Bronze

Contact Plating: Gold

Contact Type: Full Bellows

RMC60DRAH

Conn Card Edge F 120 POS 2.54mm Solder RA Thru-Hole

Through Hole

Active

Card Thickness: 0.062inch

Color: Green

Contact Material: Bronze

Contact Plating: Gold

RMC65DRYI

Conn Card Edge F 130 POS 2.54mm Solder ST Thru-Hole

Through Hole

Active

Card Thickness: 0.062inch

Color: Green

Contact Material: Bronze

Contact Plating: Gold

RMC60DRAN

Conn Card Edge F 120 POS 2.54mm Solder RA Thru-Hole

Through Hole

Active

Card Thickness: 0.062inch

Color: Green

Contact Material: Bronze

Contact Plating: Gold

RMC60DREN

Conn Card Edge F 120 POS 2.54mm Solder Lug ST

Active

Color: Green

Contact Material: Bronze

Contact Plating: Gold

Contact Type: Full Bellows

Search Results for "M95640-RMC6TG"

Filters

M95128-RMC6P

128Kbit Serial-SPI EEPROM, 8-Pin UFDFPN, 2.5-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24512-RMC6TP

512Kbit Serial-I2C EEPROM, 64Kx8, 8-Pin UFDFPN, 2.5-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24LR04E-RMC6T/2

NFC/RFID EEPROM Tag 4Kbit Serial 1.8-5.5V Industrial 8-Pin UFDFPN

DFN

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24LR64E-RMC6T/2

NFC/RFID EEPROM IC, 64Kbit, 13.56MHz, 8-Pin UFDFPN, Industrial

DFN

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24LR16E-RMC6T/2

NFC/RFID EEPROM IC, 16Kbit, 8-Pin UFDFPN, Industrial

DFN

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

+16

M93C66-RMC6P

MICROWIRE BUS SERIAL EEPROM

UFDFP-8

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

+15

M95128-RMC3G/K

128Kb Serial-SPI EEPROM, 8-Pin UFDFPN, 2.5-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95128-RMC3P/K

128Kbit Serial-SPI EEPROM, 16Kx8, 2.5-5V, 8-Pin UFDFPN

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95128-RMC3TG/K

128Kbit Serial-SPI EEPROM, 8-Pin UFDFPN, 2.5-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95128-RMC3TP/K

128Kbit Serial-SPI EEPROM, 8-Pin UFDFPN, 2.5-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

RMC65DRAH

Conn Card Edge F 130 POS 2.54mm Solder RA Thru-Hole

Through Hole

Active

Card Thickness: 0.062inch

Color: Green

Contact Material: Bronze

Contact Plating: Gold

RMC65DREF

Conn Card Edge F 130 POS 2.54mm Solder Lug ST Panel Mount

Panel Mount

Active

Card Thickness: 0.062inch

Color: Green

Contact Material: Bronze

Contact Plating: Gold

RMC60DRYI

Conn Card Edge F 120 POS 2.54mm Solder ST Thru-Hole

Through Hole

Active

Color: Green

Contact Material: Bronze

Contact Plating: Gold

Contact Type: Full Bellows

RMC65DRYN

Conn Card Edge F 130 POS 2.54mm Solder ST Thru-Hole

Through Hole

Active

Color: Green

Contact Material: Bronze

Contact Plating: Gold

Contact Type: Full Bellows

RMC60DTEH

Conn Card Edge F 120 POS 2.54mm Solder Lug ST Panel Mount

Panel Mount

Active

Color: Green

Contact Material: Bronze

Contact Plating: Gold

Contact Type: Full Bellows

RMC60DREH

Conn Card Edge F 120 POS 2.54mm Solder Lug ST Panel Mount

Panel Mount

Active

Color: Green

Contact Material: Bronze

Contact Plating: Gold

Contact Type: Full Bellows

RMC60DRAH

Conn Card Edge F 120 POS 2.54mm Solder RA Thru-Hole

Through Hole

Active

Card Thickness: 0.062inch

Color: Green

Contact Material: Bronze

Contact Plating: Gold

RMC65DRYI

Conn Card Edge F 130 POS 2.54mm Solder ST Thru-Hole

Through Hole

Active

Card Thickness: 0.062inch

Color: Green

Contact Material: Bronze

Contact Plating: Gold

RMC60DRAN

Conn Card Edge F 120 POS 2.54mm Solder RA Thru-Hole

Through Hole

Active

Card Thickness: 0.062inch

Color: Green

Contact Material: Bronze

Contact Plating: Gold

RMC60DREN

Conn Card Edge F 120 POS 2.54mm Solder Lug ST

Active

Color: Green

Contact Material: Bronze

Contact Plating: Gold

Contact Type: Full Bellows