Search Results for "QPB9331"

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QP7C263-35KMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: FPAK

Package/Case: FPAK

Package Description: Flat Package

QP7C261-35TMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: FPAK

Package/Case: Windowed CFPAK

Lead Shape: Flat

QP7C263-70QMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

LLCC

Active

Package Family Name: LLCC

Package/Case: LLCC

Package Description: Leadless Ceramic Carrier

Pin Count: 28

QP7C261-45TMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

CFPAK

Active

Package Family Name: CFPAK

Package/Case: Windowed FPAK

Pin Count: 24

PCB: 24

QP7C263-70TMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

Surface Mount

Active

Package/Case: FPACK

Pin Count: 24

PCB: 24

Mounting: Surface Mount

QP7C271-55DMB

Teledyne

EPROM OTP 256K-bit 32K x 8 55ns 28-Pin CDIP

Datasheet

Through Hole

Active

Basic Package Type: Through Hole

Package Family Name: DIP

Package/Case: CDIP

Package Description: Ceramic Dual In Line Package

+19

QP7C263-35LMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: LLCC

Package/Case: CLLCC

Package Description: Ceramic Leadless Chip Carrier

QP7C261-35LMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: LLCC

Package/Case: CLLCC

Package Description: Ceramic Leadless Chip Carrier

QP7C263-35WMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

Through Hole

Active

Basic Package Type: Through Hole

Package Family Name: DIP

Package/Case: Windowed CDIP

Package Description: Windowed Ceramic Dual In Line Package

QP7C263-25QMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: LLCC

Package/Case: Windowed CLLCC

Lead Shape: No Lead

QP7C261-25QMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: LLCC

Package/Case: Windowed CLLCC

Lead Shape: No Lead

QP7C263-35QMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: LLCC

Package/Case: Windowed CLLCC

Lead Shape: No Lead

QP7C261-55QMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

LCC

Active

Package Family Name: LCC

Package/Case: Windowed LCC

Pin Count: 28

PCB: 28

QP7C271-35TMB

Teledyne

EPROM UV 256K-bit 32K x 8 35ns 28-Pin Windowed CFPAK

Datasheet

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: CFPAK

Package/Case: Windowed CFPAK

Lead Shape: Flat

+18

QP7C271-55LMB

Teledyne

EPROM OTP 256K-bit 32K x 8 55ns 32-Pin LCC

Datasheet

LCC

Active

Package Family Name: LCC

Package/Case: LCC

Pin Count: 32

PCB: 32

+16

QP7C261-55DMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

Through Hole

Active

Basic Package Type: Through Hole

Package Family Name: DIP

Package/Case: CDIP

Package Description: Ceramic Dual In Line Package

QP7C261-25WMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

Through Hole

Active

Basic Package Type: Through Hole

Package Family Name: DIP

Package/Case: Windowed CDIP

Package Description: Windowed Ceramic Dual In Line Package

QP7C263-35DMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

Through Hole

Active

Basic Package Type: Through Hole

Package Family Name: DIP

Package/Case: CDIP

Package Description: Ceramic Dual In Line Package

QP7C263-45WMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

Through Hole

Active

Basic Package Type: Through Hole

Package Family Name: DIP

Package/Case: Windowed CDIP

Package Description: Windowed Ceramic Dual In Line Package

QP7C263-35TMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: FPAK

Package/Case: Windowed CFPAK

Lead Shape: Flat

Search Results for "QPB9331"

Filters

QP7C263-35KMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: FPAK

Package/Case: FPAK

Package Description: Flat Package

QP7C261-35TMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: FPAK

Package/Case: Windowed CFPAK

Lead Shape: Flat

QP7C263-70QMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

LLCC

Active

Package Family Name: LLCC

Package/Case: LLCC

Package Description: Leadless Ceramic Carrier

Pin Count: 28

QP7C261-45TMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

CFPAK

Active

Package Family Name: CFPAK

Package/Case: Windowed FPAK

Pin Count: 24

PCB: 24

QP7C263-70TMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

Surface Mount

Active

Package/Case: FPACK

Pin Count: 24

PCB: 24

Mounting: Surface Mount

QP7C271-55DMB

Teledyne

EPROM OTP 256K-bit 32K x 8 55ns 28-Pin CDIP

Datasheet

Through Hole

Active

Basic Package Type: Through Hole

Package Family Name: DIP

Package/Case: CDIP

Package Description: Ceramic Dual In Line Package

+19

QP7C263-35LMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: LLCC

Package/Case: CLLCC

Package Description: Ceramic Leadless Chip Carrier

QP7C261-35LMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: LLCC

Package/Case: CLLCC

Package Description: Ceramic Leadless Chip Carrier

QP7C263-35WMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

Through Hole

Active

Basic Package Type: Through Hole

Package Family Name: DIP

Package/Case: Windowed CDIP

Package Description: Windowed Ceramic Dual In Line Package

QP7C263-25QMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: LLCC

Package/Case: Windowed CLLCC

Lead Shape: No Lead

QP7C261-25QMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: LLCC

Package/Case: Windowed CLLCC

Lead Shape: No Lead

QP7C263-35QMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: LLCC

Package/Case: Windowed CLLCC

Lead Shape: No Lead

QP7C261-55QMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

LCC

Active

Package Family Name: LCC

Package/Case: Windowed LCC

Pin Count: 28

PCB: 28

QP7C271-35TMB

Teledyne

EPROM UV 256K-bit 32K x 8 35ns 28-Pin Windowed CFPAK

Datasheet

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: CFPAK

Package/Case: Windowed CFPAK

Lead Shape: Flat

+18

QP7C271-55LMB

Teledyne

EPROM OTP 256K-bit 32K x 8 55ns 32-Pin LCC

Datasheet

LCC

Active

Package Family Name: LCC

Package/Case: LCC

Pin Count: 32

PCB: 32

+16

QP7C261-55DMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

Through Hole

Active

Basic Package Type: Through Hole

Package Family Name: DIP

Package/Case: CDIP

Package Description: Ceramic Dual In Line Package

QP7C261-25WMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

Through Hole

Active

Basic Package Type: Through Hole

Package Family Name: DIP

Package/Case: Windowed CDIP

Package Description: Windowed Ceramic Dual In Line Package

QP7C263-35DMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

Through Hole

Active

Basic Package Type: Through Hole

Package Family Name: DIP

Package/Case: CDIP

Package Description: Ceramic Dual In Line Package

QP7C263-45WMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

Through Hole

Active

Basic Package Type: Through Hole

Package Family Name: DIP

Package/Case: Windowed CDIP

Package Description: Windowed Ceramic Dual In Line Package

QP7C263-35TMB

Teledyne

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Datasheet

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: FPAK

Package/Case: Windowed CFPAK

Lead Shape: Flat