Search Results for &quot; a7818a hp development company l p 88619295 &quot;

Telecom Transformer 1:1 0.25Ohm Prim. DCR 16Term. Gull Wing SMD

Obsolete

Package/Case: SMD/SMT

DC Resistance (DCR): 250mR

Depth: 10.67mm

Height: 10.67mm

+15

5962-8861009ZA

SRAM 32K(2KX16)CMOS DUALPORT R

Volume Production

Access Time: 70ns

Address Bus Width: 22b

Package/Case: PGA

Density: 32Kb

A7802T

Telecom Transformer 1:1 0.25Ohm Prim. DCR 16 Terminal Gull Wing SMD

Surface Mount

Obsolete

Height: 10.67mm

Length: 12.7mm

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

CORE429-DEV-KIT-3

Microsemi

KIT DEV FOR CORE429 IP MODULE

Not Recommended for New Design

Package/Case: Module

Series: Fusion®

COMPOSIT190PTS

Tool case 446 x 340 x 190 mm 5 kg Aluminium-rubber, COMPOSIT 190 PTS, GT Line

Volume Production

Material: Aluminium, Rubber

Weight: 5kg

MDM-1-DEV-1

Lascar Electronics

Development system,MDM-DEV-1

Volume Production

Backlight Type: LED

Depth: 9.2mm

Height: 34.5mm

Interface: RS-232

COMPOSIT190PEL

Tool case 446 x 340 x 190 mm 5 kg Aluminium-rubber, COMPOSIT 190 PEL, GT Line

Volume Production

Material: Aluminium, Rubber

Weight: 5kg

5962-8861011ZA

SRAM 32K(2KX16)CMOS DUALPORT R

Volume Production

Access Time: 55ns

Address Bus Width: 22b

Package/Case: PGA

Density: 32Kb

5962-8861007ZA

SRAM 32K(2KX16)CMOS DUALPORT R

Volume Production

Access Time: 90ns

Address Bus Width: 22b

Package/Case: PGA

Density: 32Kb

+17

5962-8861012ZA

SRAM 32K(2KX16)CMOS DUALPORT R

Volume Production

Access Time: 55ns

Address Bus Width: 22b

Package/Case: PGA

Density: 32Kb

PC-I2C-DEV

FDI

Interface Development Tools I2C Software Development Kit

End of Life

Interface: I2C, Parallel

Operating Supply Voltage: 1.2V

Packaging: Bulk

EC1100HS-83.8861M

Ecliptek

Oscillator XO 83.8861MHz ±100ppm 15pF HCMOS/TTL 60% 5V 4-Pin Metal DIP Thru-Hole Bulk

Through Hole

Obsolete

Basic Package Type: Through Hole

Package Family Name: DIP

Package/Case: Metal DIP

Package Description: Metal Dual In Line Package

G-COMS

Greenwich Instruments

TELEPHONE MP3 UNIT, G-COMS

Unknown

Color: Black

COM8-1

Daniels

Daniels Manufacturing Crimp Tool Crimp Contact, 0.5 2.5 mm Wire Size

Volume Production

Length: 190.5mm

COM-EBX-R-00

Adlink

Development Boards & Kits - x86 EBX CARRIER BOARD COM-Express TYPE 2

Obsolete

Interface: Serial, Ethernet, PCI

Max Operating Temperature: 70°C

Min Operating Temperature: -20°C

Operating Supply Voltage: 5V

IS-DEVKIT-4

NKK Switches

Switch Development Tools Development Kit W/2 Compact RGB

Volume Production

Evaluation Kit: Yes

Lead Free: Lead Free

Package Quantity: 1

DSC1104CM2-083.8861

Oscillator MEMS 83.8861MHz ±25ppm (Stability) 15pF HCSL 52% 2.5V/3.3V Automotive 6-Pin VDFN SMD Tube

Non-Lead-Frame SMT

Unconfirmed

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: VDFN

Package Description: Very Thin Dual Flat No Lead

DSC1124AL5-083.8861

Oscillator MEMS 83.8861MHz ±10ppm (Stability) 15pF HCSL 52% 2.5V/3.3V 6-Pin VDFN EP SMD Tube

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: VDFN EP

Package Description: Very Thin Dual Flat No Lead, Exposed Pad

DSC1104AE1-083.8861

Oscillator MEMS 83.8861MHz ±50ppm (Stability) 15pF HCSL 52% 2.5V/3.3V 6-Pin VDFN EP SMD Tube

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: VDFN EP

Package Description: Very Thin Dual Flat No Lead, Exposed Pad

DSC1104DM5-083.8861

Oscillator MEMS 83.8861MHz ±10ppm (Stability) 15pF HCSL 52% 2.5V/3.3V Automotive 6-Pin VDFN SMD Tube

Non-Lead-Frame SMT

Unconfirmed

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: VDFN

Package Description: Very Thin Dual Flat No Lead

Search Results for "a7818a hp development company l p 88619295"

Filters

A7802

Telecom Transformer 1:1 0.25Ohm Prim. DCR 16Term. Gull Wing SMD

Obsolete

Package/Case: SMD/SMT

DC Resistance (DCR): 250mR

Depth: 10.67mm

Height: 10.67mm

+15

5962-8861009ZA

SRAM 32K(2KX16)CMOS DUALPORT R

Volume Production

Access Time: 70ns

Address Bus Width: 22b

Package/Case: PGA

Density: 32Kb

A7802T

Telecom Transformer 1:1 0.25Ohm Prim. DCR 16 Terminal Gull Wing SMD

Surface Mount

Obsolete

Height: 10.67mm

Length: 12.7mm

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

CORE429-DEV-KIT-3

Microsemi

KIT DEV FOR CORE429 IP MODULE

Not Recommended for New Design

Package/Case: Module

Series: Fusion®

COMPOSIT190PTS

Tool case 446 x 340 x 190 mm 5 kg Aluminium-rubber, COMPOSIT 190 PTS, GT Line

Volume Production

Material: Aluminium, Rubber

Weight: 5kg

MDM-1-DEV-1

Lascar Electronics

Development system,MDM-DEV-1

Volume Production

Backlight Type: LED

Depth: 9.2mm

Height: 34.5mm

Interface: RS-232

COMPOSIT190PEL

Tool case 446 x 340 x 190 mm 5 kg Aluminium-rubber, COMPOSIT 190 PEL, GT Line

Volume Production

Material: Aluminium, Rubber

Weight: 5kg

5962-8861011ZA

SRAM 32K(2KX16)CMOS DUALPORT R

Volume Production

Access Time: 55ns

Address Bus Width: 22b

Package/Case: PGA

Density: 32Kb

5962-8861007ZA

SRAM 32K(2KX16)CMOS DUALPORT R

Volume Production

Access Time: 90ns

Address Bus Width: 22b

Package/Case: PGA

Density: 32Kb

+17

5962-8861012ZA

SRAM 32K(2KX16)CMOS DUALPORT R

Volume Production

Access Time: 55ns

Address Bus Width: 22b

Package/Case: PGA

Density: 32Kb

PC-I2C-DEV

FDI

Interface Development Tools I2C Software Development Kit

End of Life

Interface: I2C, Parallel

Operating Supply Voltage: 1.2V

Packaging: Bulk

EC1100HS-83.8861M

Ecliptek

Oscillator XO 83.8861MHz ±100ppm 15pF HCMOS/TTL 60% 5V 4-Pin Metal DIP Thru-Hole Bulk

Through Hole

Obsolete

Basic Package Type: Through Hole

Package Family Name: DIP

Package/Case: Metal DIP

Package Description: Metal Dual In Line Package

G-COMS

Greenwich Instruments

TELEPHONE MP3 UNIT, G-COMS

Unknown

Color: Black

COM8-1

Daniels

Daniels Manufacturing Crimp Tool Crimp Contact, 0.5 2.5 mm Wire Size

Volume Production

Length: 190.5mm

COM-EBX-R-00

Adlink

Development Boards & Kits - x86 EBX CARRIER BOARD COM-Express TYPE 2

Obsolete

Interface: Serial, Ethernet, PCI

Max Operating Temperature: 70°C

Min Operating Temperature: -20°C

Operating Supply Voltage: 5V

IS-DEVKIT-4

NKK Switches

Switch Development Tools Development Kit W/2 Compact RGB

Volume Production

Evaluation Kit: Yes

Lead Free: Lead Free

Package Quantity: 1

DSC1104CM2-083.8861

Oscillator MEMS 83.8861MHz ±25ppm (Stability) 15pF HCSL 52% 2.5V/3.3V Automotive 6-Pin VDFN SMD Tube

Non-Lead-Frame SMT

Unconfirmed

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: VDFN

Package Description: Very Thin Dual Flat No Lead

DSC1124AL5-083.8861

Oscillator MEMS 83.8861MHz ±10ppm (Stability) 15pF HCSL 52% 2.5V/3.3V 6-Pin VDFN EP SMD Tube

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: VDFN EP

Package Description: Very Thin Dual Flat No Lead, Exposed Pad

DSC1104AE1-083.8861

Oscillator MEMS 83.8861MHz ±50ppm (Stability) 15pF HCSL 52% 2.5V/3.3V 6-Pin VDFN EP SMD Tube

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: VDFN EP

Package Description: Very Thin Dual Flat No Lead, Exposed Pad

DSC1104DM5-083.8861

Oscillator MEMS 83.8861MHz ±10ppm (Stability) 15pF HCSL 52% 2.5V/3.3V Automotive 6-Pin VDFN SMD Tube

Non-Lead-Frame SMT

Unconfirmed

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: VDFN

Package Description: Very Thin Dual Flat No Lead