PackageWLCSP
MountingSurface Mount
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Technical Specifications
Semtech SX8650ICSTRT technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
WLCSP
Package Description
Wafer Level Chip Scale Package
Lead Shape
Ball
Pin Count
12
PCB
12
Package Length (mm)
2
Package Width (mm)
0.36(Max)
Package Height (mm)
0.63(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Type
Resistive
Max Operating Supply Voltage
3.7V
Resolution
12bit
Interface Type
I2C
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
14099
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Semtech SX8650ICSTRT Datasheet
Download the complete datasheet for Semtech SX8650ICSTRT to view detailed technical specifications.
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