Dual SPDT analog switch, featuring a 12-pin TDFN EP surface-mount package with a 0.5mm pin pitch. This integrated circuit offers two channels, each with a single-pole double-throw (SPDT) switch architecture, providing two inputs and four outputs per chip. Designed for non-inverting operation, it exhibits a maximum on-resistance range of 10 to 25 Ohms. The compact plastic package measures 3mm x 1mm x 0.8mm (Max) with an exposed pad for enhanced thermal performance, operating across a temperature range of -40°C to 85°C.
SG Micro SGM3158YD/TR technical specifications.
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | DFN |
| Package/Case | TDFN EP |
| Package Description | Thin Dual Flat Package No Lead, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 12 |
| PCB | 12 |
| Package Length (mm) | 3 |
| Package Width (mm) | 1 |
| Package Height (mm) | 0.8(Max) |
| Seated Plane Height (mm) | 0.8 |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Type | Analog Switch |
| Configuration | Dual SPDT |
| Number of Channels per Chip | 2 |
| Switch Architecture | SPDT |
| Number of Inputs per Chip | 2 |
| Number of Outputs per Chip | 4 |
| Polarity | Non-Inverting |
| Maximum On Resistance Range | 10 to 25Ohm |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Radiation Hardening | No |
Download the complete datasheet for SG Micro SGM3158YD/TR to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.