Dual SPDT analog switch, featuring a 12-pin TDFN EP surface-mount package with a 0.5mm pin pitch. This integrated circuit offers two channels, each with a single-pole double-throw (SPDT) switch architecture, providing two inputs and four outputs per chip. Designed for non-inverting operation, it exhibits a maximum on-resistance range of 10 to 25 Ohms. The compact plastic package measures 3mm x 1mm x 0.8mm (Max) with an exposed pad for enhanced thermal performance, operating across a temperature range of -40°C to 85°C.
PackageTDFN EP
MountingSurface Mount
PolarityNon-Inverting
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Technical Specifications
SG Micro SGM3158YD/TR technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
DFN
Package/Case
TDFN EP
Package Description
Thin Dual Flat Package No Lead, Exposed Pad
Lead Shape
No Lead
Pin Count
12
PCB
12
Package Length (mm)
3
Package Width (mm)
1
Package Height (mm)
0.8(Max)
Seated Plane Height (mm)
0.8
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Type
Analog Switch
Configuration
Dual SPDT
Number of Channels per Chip
2
Switch Architecture
SPDT
Number of Inputs per Chip
2
Number of Outputs per Chip
4
Polarity
Non-Inverting
Maximum On Resistance Range
10 to 25Ohm
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Radiation Hardening
No
Datasheet
SG Micro SGM3158YD/TR Datasheet
Download the complete datasheet for SG Micro SGM3158YD/TR to view detailed technical specifications.
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