PackageTO-126
MountingThrough Hole
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Technical Specifications
Silicon First International 2SD882G technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
TO-225-AA
Package/Case
TO-126
Package Description
Transistor Outline Package
Lead Shape
Through Hole
Pin Count
3
PCB
3
Package Material
Plastic
Mounting
Through Hole
Type
NPN
Configuration
Single
Number of Elements per Chip
1
Maximum Collector Base Voltage
40V
Maximum Emitter Base Voltage
5V
Maximum Collector-Emitter Voltage
30V
Maximum DC Collector Current
3A
Maximum Power Dissipation
10000mW
Material
Si
Minimum DC Current Gain
200@1A@2V
Maximum Transition Frequency
90(Typ)MHz
Category
Bipolar Power
Min Operating Temperature
-55°C
Max Operating Temperature
150°C
Compliance
HTS Code
8541290075
Schedule B
8541290080
ECCN
EAR99
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Silicon First International 2SD882G Datasheet
Download the complete datasheet for Silicon First International 2SD882G to view detailed technical specifications.
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