Frequency25MHz
PackageDIP
MountingThrough Hole
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Technical Specifications
Silicon Labs C8051F330D technical specifications.
General
Access Time
25us
Package/Case
DIP
Core Architecture
8051
Data Bus Width
8b
Interface
I2C, SPI, UART, USART, SMBus, 2-Wire
Lead Free
Contains Lead
Max Frequency
25MHz
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Max Supply Voltage
3.6V
Memory Size
8KB
Memory Type
FLASH,
Min Supply Voltage
2.7V
Mount
Through Hole
Number of I/Os
17
Number of Programmable I/O
17
Number of Timers/Counters
4
Oscillator Type
Internal
Packaging
Rail/Tube
Peripherals
POR, PWM, WDT, Temp Sensor
RAM Size
768B
RoHS Compliant
Yes
Series
C8051F33x
Compliance
RoHS
Compliant
Datasheet
Silicon Labs C8051F330D Datasheet
Download the complete datasheet for Silicon Labs C8051F330D to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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