PackageSSOP
MountingSurface Mount
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Technical Specifications
Silicon Labs CY28329OXC technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SSOP
Package Description
Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
56
PCB
56
Package Length (mm)
18.54(Max)
Package Width (mm)
7.6(Max)
Package Height (mm)
2.39(Max)
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-118AB
Number of Outputs per Chip
24
Input Logic Level
Crystal|LVTTL
Clock Input Frequency
14.318(Typ)MHz
Min Operating Supply Voltage
3.135V
Max Operating Supply Voltage
3.465V
Maximum Power Dissipation
1000mW
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
6SQ24
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Silicon Labs CY28329OXC Datasheet
Download the complete datasheet for Silicon Labs CY28329OXC to view detailed technical specifications.
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