PackageTSSOP-II
MountingSurface Mount
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Technical Specifications
Silicon Labs CY28329ZXC technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP-II
Package Description
Thin Shrink Small Outline Package (Type II)
Lead Shape
Gull-wing
Pin Count
56
PCB
56
Package Length (mm)
14.1(Max)
Package Width (mm)
6.2(Max)
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1.1(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-153
Number of Outputs per Chip
24
Input Logic Level
Crystal|LVTTL
Clock Input Frequency
14.318(Typ)MHz
Min Operating Supply Voltage
3.135V
Max Operating Supply Voltage
3.465V
Maximum Power Dissipation
1000mW
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
6SQ24
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Silicon Labs CY28329ZXC Datasheet
Download the complete datasheet for Silicon Labs CY28329ZXC to view detailed technical specifications.
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