PackageQFN EP
MountingSurface Mount
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Technical Specifications
Silicon Labs CY28551LFXC-3 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
QFN EP
Package Description
Quad Flat No Lead Package, Exposed Pad
Lead Shape
No Lead
Pin Count
56
PCB
56
Package Length (mm)
8.10(Max)
Package Width (mm)
8.10(Max)
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Number of Outputs per Chip
20
Input Logic Level
Crystal|LVTTL
Clock Input Frequency
14.318(Typ)MHz
Min Operating Supply Voltage
3.135V
Max Operating Supply Voltage
3.465V
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Compliance
Cage Code
6SQ24
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Silicon Labs CY28551LFXC-3 Datasheet
Download the complete datasheet for Silicon Labs CY28551LFXC-3 to view detailed technical specifications.
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