PackageTSSOP-II
MountingSurface Mount
Quick Jump:
Technical Specifications
Silicon Labs CYI9530ZXCT technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP-II
Package Description
Thin Shrink Small Outline Package (Type II)
Lead Shape
Gull-wing
Pin Count
48
PCB
48
Package Length (mm)
12.6(Max)
Package Width (mm)
6.2(Max)
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1.1(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Type
Fanout Buffer
Number of Outputs per Chip
10
Input Logic Level
Crystal
Maximum Input Frequency
33.3MHz
Min Operating Supply Voltage
3.135V
Max Operating Supply Voltage
3.465V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
6SQ24
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Silicon Labs CYI9530ZXCT Datasheet
Download the complete datasheet for Silicon Labs CYI9530ZXCT to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.