PackageDIP
MountingThrough Hole
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Technical Specifications
Silicon Microstructures SM5652-001-D-3-L technical specifications.
General
| Basic Package Type | Through Hole |
| Package Family Name | DIP |
| Package/Case | DIP |
| Package Description | Dual In Line Package |
| Lead Shape | Through Hole |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 15.24 |
| Package Width (mm) | 14.73 |
| Package Height (mm) | 12.19(Max) + 4.57 |
| Seated Plane Height (mm) | 12.19(Max) + 4.57 |
| Pin Pitch (mm) | 2.54 |
| Mounting | Through Hole |
Datasheet
Silicon Microstructures SM5652-001-D-3-L Datasheet
Download the complete datasheet for Silicon Microstructures SM5652-001-D-3-L to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.